ISIG process

Immersion silver and semi-autocatalytic gold plating

Umicores´ silver and gold plating process (ISIG) provides customers a high performance nickel-free coating which meets most of the common assembly requirements like multiple solderability and bondability with aluminium and gold wire even by existing thermal ageing stress before assembly.

Due to its outstanding film characteristics ISIG deposition is very well suited to withstand the higher requirements of PCB designer concerning fine pattern ability and high frequency signal transfer in combination with complying newest RoHs and WEEE regulations.