ARGUNA® ET-S Fine Silver Electrolyte

High-speed silver plating solution for continuous reel-to-reel plating.

ARGUNA® ET-S silver plating solution is an alkaline cyanide electrolyte specially developed for high-speed silver plating equipment using continuous reel-to-reel technology with flow or spray processes. The plating process produces a smooth, fine-grained, semi-bright deposit, particularly suitable for semiconductor technology.

The current density and plating speed depend on the agitation level of the solution at the workpiece, which varies according to the equipment used. High solution flow rates allow the use of high current densities.

Plating solution characteristics

• Solution type: Alkaline cyanide
• Metal content: 100 g/L Ag
• pH value: 12.5
• Operating temperature: 30 – 75 °C, optimum 35 °C
• Current density range: 10 – 150 A/dm²
• Plating rate: 0.2 – 1.5 μm/s
• Anode material: Pure silver or MMO, PLATINODE® 167 or 177 type
• Conductivity: >50 m*(Ω*mm²)-1

Coating characteristics

• Coating: Pure silver
• Purity: 99.9 wt.% Ag
• Deposit color: White
• Brightness: Semi-bright
• Hardness: 110 HV, as-plated
• Maximum coating thickness: 100 μm

Advantages

• High-speed plating solution, suitable for full-surface and selective pure silver plating
• Designed for continuous reel-to-reel plating using flow or spray technology
• Semi-bright coating with good solderability and bondability
• Soluble anodes can be used

Applications

• Contact surfaces for electrical and electronic components