PALLUNA® ACF-800 Pure Palladium Electrolyte

Pure Palladium plating solution free from ammonia and chloride

PALLUNA® ACF-800 is a new neutral pure palladium plating solution with a wide operating range and can be plated directly onto nickel, copper, or copper alloys. The solution is ammonia-free, eliminating unpleasant odors, while also extending electrode lifetime and reducing system corrosion due to the absence of chloride. The deposited coating is ultra-bright, crack-free, low-stress, ductile, and highly corrosion-resistant.

Through continuous activated carbon treatment, organic decomposition products in the solution can be removed.

Plating Solution Characteristics

• Plating solution type: Ammonia-free and chloride-free
• Metal content: 12 (5 – 30) g/l Pd
• pH value: 6.5
• Operating temperature: 55 – 65 °C
• Current density range: Up to 25 A/dm²
• Plating speed: Up to 4 μm/min at 20 A/dm²
• Anode material: MMO (PLATINODE® 187 SO type)

Coating Characteristics

• Coating type: Pure palladium
• Purity: 99.9 wt.% Pd
• Coating color: White / bright and glossy
• Gloss level: Bright glossy
• Hardness: Approx. 280 HV
• Coating density: Approx. 12 g/cm³
• Corrosion resistance: Good

Advantages

• No unpleasant ammonia odor
• Easy solution maintenance
• High plating speed
• Neutral solution, ammonia-free and chloride-free
• Ductile, ultra-bright, crack-free coating
• Good solderability and adhesion
• Suitable for rack plating and reel-to-reel plating

Applications

• Printed Circuit Boards (PCB)
• Plug-in card contacts
• Smartcards
• Bonding wires