DIG process

Plating of direct immersion gold

Ever increasing electric components density and high frequencies of signal transmission require new concepts of final finishes in PCB manufacturing, too. By direct gold plating on copper (DIG) beside ISIG and EPIG a further process has been provided, which is free from nickel and has a high HF performance.

Due to its outstanding film characteristics DIG deposits are very well suited to withstand the higher requirements of PCB designers concerning fine pattern ability and high performance regarding soldering and wire bonding.