Pure palladium electrolyte with excellent bonding and solderability
PALLUNA® 452 is a weakly ammoniacal electrolyte for the deposition of palladium in continuous systems and rack plating. It is used especially where excellent bondability and solderability are required.
The electrolyte has already been used for years in semiconductor technology and is mainly used in selective high-speed deposition. It is particularly suitable for systems with immersion cells, belt cells, brush cells, jet and spot systems.
Reviews
There are no reviews yet.