IntraCu® Additives*

Umicore´s business unit Electroplating have partnered with SHINHAO Materials to provide innovative patented additives* for copper electroplating into the advanced packaging industry.

IntraCu®* as a modular Copper electroplating additive system embodies an integral part of our joint product offering. It is manufactured in state-of-the-art clean room environment to meet quality standards of the semiconductor industry.

IntraCu®* additives can be seen as a POR replacement for Microbumps in IC packages, RDL in wafer level packaging and Pillar in flip-chip packaging.