AURUNA® 556 EF-24 Fine Gold Electrolyte for Electroforming

Gold electroforming electrolyte for hollow jewelry

AURUNA® 556 EF-24 is particularly suitable for electroforming technology. The plating solution produces a hard, semi-bright gold layer with high thickness. It is mainly used for manufacturing high-quality hollow jewelry with a coating thickness of 150–200 micrometers. Mandrels can be made from wax or metal.

The coating has high hardness of up to 200 HV and a purity above 99.9%, ensuring customer satisfaction due to excellent mechanical stability during use. The deposit is easy to polish, has good surface quality, and shows excellent solderability.

AURUNA® 556 EF-24 is also ideal for depositing thick pure gold layers on both precious and non-precious metal substrates. Its flexible application enables the development of completely new designs.

Plating solution characteristics

• Type of plating solution: Neutral
• Metal content: 12 (12–20) g/l Au
• pH value: 6 (5.8–6.2)
• Operating temperature: 45 °C
• Current density range: 0.5 A/dm²
• Deposition rate: 0.23 μm/min
• Anode material: Pt-Ti (PLATINODE® Pt-Ti type)

Coating characteristics

• Coating: Pure gold
• Purity: 99.9 wt.% Au
• Color: Gold
• Brightness: Semi-bright
• Hardness: 200 HV
• Maximum coating thickness: Several hundred μm
• Density: approx. 19.0 g/cm³

Advantages

• 24K gold plating solution for electroforming applications
• Suitable for wax and metal mandrels
• Coating thickness of 150–200 μm
• High hardness up to 200 HV at 99.9% purity

Applications

• Electroforming
• Hollow jewelry
• High-end jewelry