ARGUNA® 4500 Fine Silver Electrolyte

High-speed silver plating solution with superior brightness

ARGUNA® 4500 is a fine silver electrolyte designed for high-speed plating, producing coatings with extremely high brightness and reflectivity. The deposited layer offers outstanding solderability, wire bonding capability, and adhesion properties.

The solution is suitable for selective plating in reel-to-reel systems, using flow plating or spray-based technologies such as jet plating and spot plating. Current density and deposition rate mainly depend on the degree of solution agitation at the part surface, specifically the flow velocity within the system.

Under optimal conditions, the coating achieves very high brightness and reflectivity, meeting the strict requirements of electronic components.

The system uses insoluble anodes and operates with very low free cyanide concentration, improving safety and process control.

Plating solution characteristics

• Type of plating solution: Weak alkaline, low free cyanide content
• Metal content: 90 (60–120) g/l Ag
• pH value: 9 (8.5–11)
• Operating temperature: 60 (50–70) °C
• Current density range: 50–250 A/dm²
• Deposition rate: up to 2.6 μm/s
• Anode material: Pt-Ti (PLATINODE® Pt/Ti type)
• Conductivity: >50 m*(Ω·mm²)-1

Coating characteristics

• Coating: Pure silver
• Purity: 99.9 wt.% Ag
• Color: White
• Brightness: High gloss
• Hardness: 100–130 HV (after plating)

Advantages

• High-speed silver plating for selective applications
• Optimized for reel-to-reel systems with flow and spray technology
• Bright and glossy coating with excellent solderability and wire bonding performance
• Uses insoluble anodes
• Low free cyanide content

Applications

• Contact surfaces for semiconductor and electronic components
• Leadframes for soldering, wire bonding, and adhesion applications