SOLICO DIAMOND

3D-modelling of any diamond shape using fiber laser to achieve a highly accurate result with minimal time and material loss.

SOLICO is an acronym for “Scanner, Optimizer and Laser Integrated Compact OGI” and it is a mean of combining the laser sawing / cutting process and a 3D mapping apparatus as a single unit. The sequence of actions when using SOLICO can be deduced from its name: measuring (scanner), optimizing the yield (optimizer) and simulating and executing process (laser).

SOLICO has 5 Axis ( X,Y,Z and 2 rotations) , a measuring device to create 3D mapping of rough stone (Scanner) and allocate the best polish shape plan (Optimizer) and executing 3D process (laser).

SOLICO, integrated with OGI Rough software, can allow you to cut rough stones at the middle or to get the best 50/50 pair rough stones or just table cut to make one single polish stone according to user’s price list to get best value. SOLICO can cut any facets, table cutting, blocking, bruting and create any 3D model shape.

SOLICO is a more advanced compact laser system than Scanox Marking machine that ables you to cut / saw the stone. Think what you can do with a Scanox marking device and just replace the laser marking with a laser cutting maintaining all the other functions of Scanox marker which is SOLICO.